DSPE Optics and Optomechanics Symposium & Fair Program Sunday 29 September TimeActivity16.00 – 17.30 hrsGuided tour @ DAF Museum Especially for the Conference guests who arrive already one day before the conference. Participants are guest of DSPE (including the visit to the Brewery Eindhoven). Registration is required.17.30 – 18.30 hrsDrinks @ Brewery Eindhoven Program Monday 30 September 09.00 – 09.30 hrs Welcome and registration / visit to the exhibition Chairman Jelm Franse Senior Director Mechanical Development at ASML09.30 – 09.50 hrs Prof.dr. Paul Urbach Sectionleader Optical Delft University of Technology & President European Optical Society EOS09.50 – 10.20 hrs Andrey Tychkov Sr. Optical Design Engineer at ASML TOMM: Thermo-opto-mechanical modeling of high power laser beam delivery system in ASML EUV Source In this work a brief overview will be showed of the ASML EUV source system, explain the significance of the thermo-mechanical effects and impact on the optical performance. Further on ways will be discussed to model these effects and results obtained with our models.10.20 – 10.50 hrs Gregor van Baars Senior System Engineer / Project manager at TNO Technical Sciences Polymerization control in Additive Manufacturing Equipment: approach and first experimental results The integration of process control strategies into AM equipment is expected to play a key role in improving product quality and equipment productivity. 10.50 – 11.30 hrs Coffee break 11.30 – 12.00 hrs Fred van Keulen ProfessorUniversity of Delft, department of Precision and Microsystems Engineering (PME) How modern mechanics can contribute to optomechanics Mechanics is often seen as one of the oldest and most developed fields in physics. This presentation highlights how modern techniques being developed in the realm 12.00 – 12.30 hrs John Quaedackers System Engineer Raith A novel height sensor for an electron beam lithography (EBL) system A novel height sensor concept for an electron beam lithography system will be presented. In case of a deflected electron beam a height error (focus) will result in a lateral beam misplacement. Therefore, the electron beam focus is continuously adapted during writing (scanning). Typical height sensors commonly applied in electron beam lithography use conventional triangulation principles. These sensors have limitations with respect to acceptable sample tilt, refractive index ,sample reflectivity, accuracy and repeatability. To serve the needs of the industry in the coming decades a new height sensor concept is under development. This concept is based on scanning low coherence interferometry. Next to the basics, the space claim and counter measures against drift will be presented. 12.30 – 14.00 hrs Lunch & visit to the exhibition14.00 – 14.30 hrs Fred Couweleers Senior Optical Designer Hittech Multin Laser Direct Write for PCB production or Opto-Mechatronics at 60.000 revs Hittech co-developed a direct write system for PCB production for LDI systems. Two key development aspects will be presented. First is the alignment strategy and hardware in relation with system design aspects like calibration, stitching and motion control. Second aspect presented is the design of one of the critical sub systems: the polygonal scanner. 14.30 – 15.00 hrs Andries Effing CTO Delmic Opto-mechanical system design challenges of a high throughput electron microscope Delmic is part of a consortium developing a high throughput electron microscope. The goal is to push the acquisition speed of electron microscopy into the gigabytes per second regime. This is made possible using recent developments in the field of detector technology, multi-beam electron microscopy, combined with new sample handling and acquisition methods. A system design approach is used to ensure image quality requirements are met. 15.00 – 15.30 hrs Pieter Tak Lead Mechanical Engineer VDL Enabling Technologies Group Productization of opto-mechanical modules for equipment In semiconductor manufacturing equipment, opto-mechanical modules are used oftentimes. These modules are not always productized, i.e. made suitable for assembly, integration and service, since the equipment will not be manufactured in large volumes. For given system designs, optimization for manufacturing, assembly, service and thus cost is possible. 15.30 – 16.00 hrs Break & visit to the exhibition16.00 – 16.30 hrs Jonee Li Head Optical Business unit GM, Shanghai Precision Measurement Semiconductor Technology Optomechatronics at the JingCe group (Wuhan, ShangHai China) The optics industry and research in China 16.30 – 17.00 hrs Frank Scholze Head of group EUV Radiometry – Physikalisch-Technische Bundesanstalt PTB EUV scatterometry for nano-structured surfaces17.00 – 17.10 hrs Conclusions of the day by chairman Jelm Franse17.10 – 18.00 hrs Drinks & visit to the exhibition18.30 – 21.00 hrs Informal dinner in the centre of Eindhoven Costs (incl. drinks) €75,- payment via registration Costs of participation Symposium Investment Costs are € 195 excl. VAT, including catering You receive € 50 reduction if you are member of DSPE Organisations are invited to exhibit Exhibition stand during symposium, space 8m2, including posterwall, electricity and standing table. We show your company logo on this website. Investment Participation exhibition: € 500 excl VAT Standcrew need to register. Costs are € 195 per person, excl VAT You receive a € 100 reduction if you are member of Holland Instrumentation, Brainport Industries, Spectaris, Optence or DSPE Partners I would like to register for the Optics Week 2019!