DSPE Optics and Optomechanics Symposium & Fair

Program Sunday 29 September

16.00 – 17.30 hrsGuided tour @ DAF Museum

Especially for the Conference guests who arrive already one day before the conference.
Participants are guest of DSPE (including the visit to the Brewery Eindhoven). Registration is required.

17.30 – 18.30 hrsDrinks @ Brewery Eindhoven

Program Monday 30 September

09.00 – 09.30 hrs

Welcome and registration / visit to the exhibition

Chairman Jelm Franse
Senior Director Mechanical Development at ASML

09.30 – 09.50 hrs

Prof.dr. Paul Urbach
Sectionleader Optical Delft University of Technology & 
President European Optical Society EOS

09.50 – 10.20 hrs

Andrey Tychkov
Sr. Optical Design Engineer at ASML

TOMM: Thermo-opto-mechanical modeling of high power laser beam delivery system in ASML EUV Source

In this work a brief overview will be showed of the ASML EUV source system, explain the significance of the thermo-mechanical effects and impact on the optical performance. Further on ways will be discussed to model these effects and results obtained with our models.

10.20 – 10.50 hrs

Gregor van Baars
Senior System Engineer / Project manager at TNO Technical Sciences

Polymerization control in Additive Manufacturing Equipment: approach and first experimental results

The integration of process control strategies into AM equipment is expected to play a key role in improving product quality and equipment productivity.

10.50 – 11.30 hrs

Coffee break

11.30 – 12.00 hrs

Fred van Keulen
ProfessorUniversity of Delft, department of Precision and Microsystems Engineering (PME)

How modern mechanics can contribute to optomechanics

Mechanics is often seen as one of the oldest and most developed fields in physics. This presentation highlights how modern techniques being developed in the realm

12.00 – 12.30 hrs

John Quaedackers
System Engineer Raith

A novel height sensor for an electron beam lithography (EBL) system

A novel height sensor concept for an electron beam lithography system will be presented. In case of a deflected electron beam a height error (focus) will result in a lateral beam misplacement. Therefore, the electron beam focus is continuously adapted during writing (scanning). Typical height sensors commonly applied in electron beam lithography use conventional triangulation principles. These sensors have limitations with respect to acceptable sample tilt, refractive index ,sample reflectivity, accuracy and repeatability.  To serve the needs of the industry in the coming decades a new height sensor concept is under development. This concept is based on scanning low coherence interferometry. Next to the basics, the space claim and counter measures against drift will be presented.

12.30 – 14.00 hrs

Lunch & visit to the exhibition

14.00 – 14.30 hrs

Fred Couweleers
Senior Optical Designer Hittech Multin

Laser Direct Write for PCB production or Opto-Mechatronics at 60.000 revs

Hittech co-developed a direct write system for PCB production for LDI systems. Two key development aspects will be presented. First is the alignment strategy and hardware in relation with system design aspects like calibration, stitching and motion control. Second aspect presented is the design of one of the critical sub systems: the polygonal scanner.

14.30 – 15.00 hrs

Andries Effing
CTO Delmic

Opto-mechanical system design challenges of a high throughput electron microscope

Delmic is part of a consortium developing a high throughput electron microscope. The goal is to push the acquisition speed of electron microscopy into the gigabytes per second regime. This is made possible using recent developments in the field of detector technology, multi-beam electron microscopy, combined with new sample handling and acquisition methods. A system design approach is used to ensure image quality requirements are met.

15.00 – 15.30 hrs

Pieter Tak
Lead Mechanical Engineer VDL Enabling Technologies Group

Productization of opto-mechanical modules for equipment

In semiconductor manufacturing equipment, opto-mechanical modules are used oftentimes. These modules are not always productized, i.e. made suitable for assembly, integration and service, since the equipment will not be manufactured in large volumes. For given system designs, optimization for manufacturing, assembly, service and thus cost is possible.

15.30 – 16.00 hrs

Break & visit to the exhibition

16.00 – 16.30 hrs

Jonee  Li
Head Optical Business unit GM, Shanghai Precision Measurement Semiconductor Technology

Optomechatronics at the JingCe group (Wuhan, ShangHai China)

The optics industry and research in China

16.30 – 17.00 hrs

Frank Scholze
Head of group EUV Radiometry – Physikalisch-Technische Bundesanstalt PTB

EUV scatterometry for nano-structured surfaces

17.00 – 17.10 hrs

Conclusions of the day
by chairman Jelm Franse

17.10 – 18.00 hrs

Drinks & visit to the exhibition

18.30 – 21.00 hrs

Informal dinner in the centre of Eindhoven

Costs (incl. drinks) €75,- payment via registration

Costs of participation



  • Costs are € 195 excl. VAT, including catering
  • You receive € 50 reduction if you are member of DSPE

Organisations are invited to exhibit

Exhibition stand during symposium, space 8m2, including posterwall, electricity and standing table. We show your company logo on this website.


  • Participation exhibition: € 500 excl VAT
  • Standcrew need to register. Costs are € 195 per person, excl VAT
  • You receive a € 100 reduction if you are member of Holland Instrumentation, Brainport Industries, Spectaris, Optence or DSPE